By Jan A. Dziuban
This is the 1st compendium on silicon/glass microsystems made via deep rainy etching and the 1st booklet with an in depth description of bonding thoughts utilized in microsystem expertise. Technological effects offered within the booklet were verified experimentally through the writer and his workforce, and will be used in day by day laboratory perform. certain recognition has been paid to the top point of accessibility of the publication by means of students.
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Bonding in Microsystem Technology: 24 (Springer Series in Advanced Microelectronics) by Jan A. Dziuban
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